Ceramic Substrate offers excellent electrical and thermal properties than tradditional metal and plastic ones, when a metal printing applied on its surface of ceramic substrate with special pattern by screen printing, like copper (Cu) coating, Molybdenum/ Manganese (Mo/Mn), silver (Ag) plating. Then it owns the characteristics of both electrical conductor and ceramics. Also, it helps to achieve the funcation to braze the ceramic to metal.
In order to meet different and specific requirement, we have been producing a variety of metallized ceramic substrates in optional materials, mainly including alumina ceramics, alunimun nitride ceramics and slicon ntride ceramics. The standard thickness cover 0.25mm, 0.30mm, 0.40mm, 0.50mm, 0.635mm and 1.0mm.
It is always to be used as printed circuit board (PCB),high Power LED ceramic substrate,microwave
(Wireless Communication & Radar),semiconductor Process Equipment,solar Cell,
hybrid Electric Vehicles, flip chip/eutectic substrate, sensor ceramic
substrate.
Metallized Ceramic Substrate,Substrate metallzation,Thick Film Ceramic Substrate,Ceramic PCB Substrate,Metalized Alumina Jinghui Industry Ltd. , https://www.ceramicteks.com
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Long Fiber reinforced thermoplastic impregnation and extrusion line (LFT-G)
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Tsh-52 Twin Screw Extruder LFT-G Long Glass Fiber
Model NO.: TSH-52
Engagement System: Intermeshing
Screw Channel Structure: Non Deep Screw
Exhaust: Exhaust
Automation: Automatic
Computerized: Computerized
Trademark: CHUANGBO
Transport Package: Wooden Box
Specification: 10 TON
Origin: Nangjing, Jiangsu
HS Code: 8477900000
Model NO.: TSH-52
Engagement System: Intermeshing
Screw Channel Structure: Non Deep Screw
Exhaust: Exhaust
Automation: Automatic
Computerized: Computerized
Trademark: CHUANGBO
Transport Package: Wooden Box
Specification: 10 TON
Origin: Nangjing, Jiangsu
HS Code: 8477900000
Long Fiber reinforced thermoplastic impregnation and extrusion line (LFT-G)