According to the steps, the thermal analysis of the three heat dissipation structures designed in the front is carried out under natural convection and forced convection (with a cooling fan). Thermal analysis of the thermal conduction plate scheme In the thermal simulation analysis, the thermal conductivity of the material is: aluminum 237W. The experimental analysis is performed on the assumption that the ambient temperature is 25 °C. The heat sink design, convection coefficient, LED own power Both have an important influence on the junction temperature distribution of LEDs. Changing these parameters has an important influence on the junction temperature distribution of LEDs. The design of the heat conduction plate of the lamp model makes the heat transfer have obstacles, and the ribs do not contribute to the heat dissipation and transmission. However, when the room temperature is 25 ° C, the maximum junction temperature also exceeds 80 ° C. If the ambient temperature is raised to 50 At °C, then after calculation, the junction temperature of the LED will be much larger than 80 °C, so the headlamp model can not meet the design requirements. The thermal analysis of the circular fin combination scheme is very obvious. The maximum heat dissipation temperature of the aluminum heat sink chip is 87 °C at an ambient temperature of 25 °C, which is about 70 °C lower than the natural convection. From this, it can be seen that natural convection has a relatively large influence on the temperature of the radiator. At room temperature of 25 ° C, the LED junction temperature is still more than 80 ° C, can not guarantee the long-term stable operation of the LED, so this cooling solution is also excluded. The thermal analysis of the uniform temperature plate scheme considers that the ambient temperature of the automobile engine is severely heated or other severe conditions reach 50 °C for a short time. In order to stabilize the lamp, the ANSYS thermal analysis is compared with the ambient temperature of 25 ° C and the ambient temperature of 50 ° C. After loading the fan, the convection coefficient increases, and the LED junction temperature is significantly reduced. In the forced convection state, the maximum temperature of the chip is 48.5 ° C when the room temperature is 25 ° C; the maximum temperature of the chip is 73.5 ° C when the room temperature is 50 ° C; Compared with the original natural convection, the LED junction temperature has dropped greatly, and the junction temperature dropped by 20 °C. The heat flux density is more obvious around the LED, that is, the heat transfer is more near the LED, and the heat flux density is smaller on the substrate. Therefore, the convection coefficient is increased, and the heat dissipation effect is obvious, and the heat dissipation scheme satisfies the national standard under the condition of 50 ° C environment, and the LED junction temperature is lower than 80 ° C, so this heat dissipation scheme is selected. The solar cell is a multi main grid structure, and there is a laser dicing area in the middle. The laser dicing area divides the solar cell into two parts to form two symmetrical multi main grid half cells. The utility model reduces the current after the Solar Module is made by the design of the multi main grid half cell, As a result, the package loss is greatly reduced and the power is increased Half-Cell Solar Pv Module,Half-Cell Solar Panel,High Efficiency Half-Cell Solar Module,Commerial Half-Cell Solar Panel Resun Solar Energy Co., Ltd. , https://www.resunsolargroup.com